Solutions

Ultra Clean Solutions

With the key line widths of semiconductor chips shrink, from the early micron (μm) level to the nano (nm) level, chip manufacturing requirements for cleanliness are getting higher and higher, and if the air cleanliness in the production process does not meet the requirements, the product yield will be greatly affected. Almost all major links in the IC industry chain, from single crystal wafer manufacturing, to IC manufacturing and packaging, need to be completed in clean rooms, which have high requirements for cleanliness.

In order to maintain the cleanliness of the clean room, the semiconductor clean room usually adopts the vertical unidirectional flow method to purify the air by pushing out the action and exhausting the indoor polluted air to the outside.

Such as: SP1/SP2 and other wafer testing equipment environment needs constant temperature and humidity clean room purification level of ISO Class5 (100), temperature accuracy of 22 ± 1 ℃, humidity 45% ± 5%. The top surface of the clean room is full of fan filtration unit + H13 high efficiency filter. The clean room adopts high precision sensing multi-point to monitor the temperature and humidity and cleanliness in real time, and display in the environment monitoring system, when the temperature and humidity change, the system can automatically control and adjust, when the cleanliness does not meet the standard, the system alarm and automatically adjust the air volume, increase the number of cycles to meet the indoor cleanliness requirements, so as to realize the closed-loop control of the environment system.

In addition to using FFU on a large area in the ceiling of the semiconductor HHI LCD panel plant to achieve unidirectional flow, the cleanliness of the area needs to be strictly controlled by building a microenvironment or installing EFU at the machine end in individual areas to meet the more stringent control standards of the machine equipment.

With the continuous improvement of process iterations, the control of particulate matter alone can no longer be submitted to yield, gaseous molecular contaminants AMC (Airborebe Molecular Contamination) control technology has become a necessary means of semiconductor yield improvement。