Solutions

Archer™ 300

 

Overlay Metrology System

Built on the industry leading Archer platform for optical overlay measurements.

The Archer 300 overlay metrology system provides robust, accurate, reliable, and reproducible overlay registration and CD measurements on various substrate types, sizes, materials and thicknesses. The industry proven Archer platform provides fast, repeatable and the system-to-system matched performance required by fabs producing products for the IOT, automotive, μLED and mobile segments.

5D Analyzer®:

1、Customizable models and analysis recipes provide accurate corrections for all steppers and scanners within your fab.

2、Multivariate analysis provides fast resolution to overlay excursions.Centralized database for all overlay results from your Archer overlay tools, steppers and scanners.

Equipment capacity ：

1、Transparent and Semi-Transparent Wafer Handling Capability:

Optional wafer loading and alignment feature supports SiC, GaN, Quartz and other clear substrate types. Accommodates 150mm – 300mm sizes.

2、Thin & Thick Wafer Handling Capability:

Optional feature accommodates wafers as thin as 350μm up to 1200μm thick substrates.

3、Advanced Alignment Microscope System (AMS):

Three LEDs are utilized for improved wafer alignment and recipe success rate on low contrast layers.

4、Variable Illumination System (VIS):

Colored filters within the optical path improve target contrast and measurement reproducibility on the most challenging and low contrast layers, including grainy metals.

5、Automatic Noise Reduction Algorithm (ANRA) and Coherence Probe Microscopy (CPM):

Optional feature package to improve measurement capability on low contrast or asymmetrical targets due to variable film or CMP processing.

6、Advanced Imaging Metrology (AIM) targets:

Optional license provides more robust overlay measurements results amid process variations caused by CMP and other processes.

7、Small AIM and μAIM targets:

15x15 and 10x10um overlay target sizes enable narrow scribe lines expanding die count per wafer.

8、AIMiD targets:

5x5um overlay targets for in die overlay.

9、Recipe Database Manager:

Optional offline software for recipe development and fleet recipe management. Improve tool productivity, recipe control and recipe success rate with automatic, imageless recipe creation opportunity for fast recipe creation and distribution to your fleet of tools before wafers arrive at that step.